The SMT floor is the heart of the plant. Three YAMAHA high-speed lines cover paste printing, SPI, placement, reflow and full AOI inspection, while our in-house DMES system handles feeder verification and paste control — the basis for the high-reliability work we do for medical, automotive and industrial customers.
What happens here
DRUTEK runs three YAMAHA high-speed SMT lines, aimed at high-mix, low-to-medium volume work with high quality expectations. The area follows ESD S20.20 with every machine and bench on a live ESD monitoring platform, and line changeover is standardised: stencil, paste and feeder status are verified by system before the line starts.
Line configuration
Printing & SPIUS MPM MOMENTUM+ printer, accuracy >2Cpk at ±25 μm (6 sigma), 12 s cycle; KOHYOUNG KY8030-3 3D paste inspection.
High-speed placementYAMAHA mounters at ±0.05 mm absolute and ±0.03 mm repeatability, handling 01005 chips up to BGA and QFN, on boards from 50×50 mm to 510×460 mm.
Reflow & inspectionUS BTU Pyramax 125N with 10 heating and 2 cooling zones and nitrogen down to 50 ppm; VITROX V510i 3D AOI at 8 μm resolution, 100% coverage.
Process control
- Paste control: thawing, mixing, open time and lot recorded; stencil cleaning and tension on the daily check list.
- First article: LanEye FA-600IV compares the board against BOM and Gerber automatically before volume starts.
- Reflow profiles: set per board thickness and panel design, measured, with periodic zone verification.
- Inspection: SPI controls the print, AOI covers placement and joints, and UNICOMP AX7500 X-ray checks BGA and through-hole joints non-destructively.
- Poka-yoke and traceability: DMES verifies feeder loading, material lots and MSD exposure time, traceable to line and timestamp.
Typical applications
Medical control and diagnostic boards, automotive controllers, industrial main boards and drive modules, telecom and power products — high-mix, low-to-medium volume work where quality cannot be traded for speed.
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