The laboratory handles inspection, analysis and rework verification — the second quality gate behind the production lines. X-ray, solderability testing and BGA rework happen here, serving both first-article validation on new products and root-cause analysis on volume issues.
What the lab is for
AOI and visual inspection only see the surface of a joint. The quality of BGA, QFN and barrel fill has to be judged by looking through the board or into a cross-section. The lab also verifies incoming solder paste, flux and PCB surface finish, and supports failure analysis for customer complaints and process excursions.
Main capabilities
X-ray inspectionLooks through BGA, QFN and through-hole joints to assess voiding, bridging and offset.
Solderability testingVerifies component leads and PCB pads, identifying oxidation, contamination and plating problems.
BGA reworkA dedicated rework station removes, reballs and refits BGAs on a controlled profile, followed by X-ray re-check.
Closing the loop
- First article and pilot runs: X-ray and key-dimension checks before volume, so issues surface early.
- Periodic sampling: X-ray sampling on BGA boards to the customer's schedule and our internal standard.
- Failure analysis: cross-section, microscopy and solderability re-test on complaints and process excursions, with a written cause and corrective action.
- Records: images and conclusions archived per part number and used as PPAP and audit evidence.
Supporting the system
Laboratory results feed the process control and traceability required by ISO 9001, IATF 16949 and ISO 13485.
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